OIE Activities and Events
The OYSTER project is planning to develop open characterisation and modelling environment to drive innovation in advanced nano-architectured and bio-inspired hard/soft interfaces. OYSTER is planning to achieve this by sharing metadata in an Open Innovation Environment, where new paradigms of multi-scale contact mechanics are validated on selected application oriented reference materials through continuous interaction with the European Materials Characterisation Council (EMCC)
OYSTER will establish a transnational and multidisciplinary Open Innovation Environment (OIE) for the characterisation of hard/soft materials’ interfaces by integrating materials characterisation and modelling on equal footing.
Please find below the contact form in order to develop the Open Innovation Environment with us.
These are some activities Oyster Partners have participated where the OIE structure has been presented:
• Industrial technologies 29 -31 October 2018, Vienna, Austria
o EMMC international workshop, Vienna, Austria
• 7th Korea-EU NanoWorkshop 2018 – 12 November 2018, Seoul, S. Korea
• EuroNanoForum 2019; 12-14 June 2019, Bucharest, Romania
o EMCC plenary meeting
• Second EMMC ontology workshop; June 6, 2019, Brussels, Belgium
• Nanotexnology 2019, 3rd of July 2019, in Thessaloniki, Greece
Contact form and Privacy Policy
All data collected by the Oyster Project will not be shared with any third party. User data collected in this form shall be used for the purposes of internal communications and networking actions of the Oyster Project.
This project is supported by the European Union under the HORIZON2020 Framework Programme Grant Agreement no. 760827
This website has been produced by the Oyster Project. Its contents are the sole responsibility of the parties and cannot be considered as reflecting the position of the European Union.
Project Information:
Project Acronym: OYSTER
Project Title: Open characterisation and modelling environment to drive innovation in advanced nano-architectured and bio-inspired hard/soft interfaces
Project Reference: 760827